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| ! " # $ % & ' ' #% #' ( )#! * + * $ # , - .' ! ' , ) #' #//(#!(-0 !"#" ! ! ! "#$ %$ &! ' ! ! ( %$ )! * * $$ * $+, - ). " & ! % ! %/% )! 0!- ! !! & $+, - ). " & ! ! $/1 $+, - ). " & " ! % ! $/2 $+, - ). " & " ! ! $/34 5 6 ! 0!- ! !! 0 $+, - ). 7"! ) % 6 ) . ( 4$ 8! 9 ! ! 0!- ! * * 0 0 $/2. 5 !. ! /%/% * )! !! * * . 5 !. ! /%$ ( & ! % ! /24 9! ( ( & ! ! /%#$ :; ( & " ! % ! /%$ ( & " ! ! /%13 forward voltage 0.01 0.1 1 10 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 s1zax tl=150 c [typ] tl=25 c [typ] pulse measurement per diode forward voltage v f [v] forward current i f [a] 0 0.4 0.8 1.2 1.6 0 0.2 0.4 0.6 0.8 1 1.2 1.4 s1zax forward power dissipation tj= 150 c sine wave average rectified forward current i o [a] forward power dissipation p f [w] 0 0.2 0.4 0.6 0.8 1 1.2 1.4 0 20 40 60 80 100 120 140 160 s1zax derating curve sine wave r-load free in air (alumina substrate) 1-circuit current 2-circuit current (glass-epoxy substrate) 1-circuit current 2-circuit current alumina substrate soldering land 1mm 1mm conductor layer 20 m substrate thickness 0.64mm glass-epoxy substrate soldering land 1mm 1mm conductor layer 35 m ambient temperature ta [ c] average rectified forward current i o [a] pcb peak surge forward capability 0 10 20 30 40 1 10 100 s1zax 2 5 20 50 i fsm 10ms 10ms 1 cycle number of cycles [cycles] peak surge forward current i fsm [a] non-repetitive, sine wave, tj=25 c before surge current is applied |
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